Silicon Wafer Polishing Slurry Features

Details of Silicon Wafer Polishing Slurry

In the process of silicon wafer machine processing, including multi-line cutting, grinding and other processing processes which will leave damage layer on the surface. At this point, chemical mechanical polishing is needed to make the silicon wafer with good flatness and finish, and ensure the lattice integrity. Therefore, it is required that the silicon wafer polishing fluid can remove the damaged layer of the silicon wafer in the same time without destroying the lattice, so Kona chose different particle silica as the basic abrasive and developed rough and final silicon wafer polishing fluid.