Alumina Polishing Slurry for Copper-Covered Ceramic Substrate Features

Copper-Covered Ceramic Substrate Polishing Slurry is developed for Copper-Covered Ceramic Substrate such as Copper-Clad ceramic substrate and Copper-Coated ceramic substrate.
According to the characteristics of copper material and high requirements of the PCB fabricate, it is a challenge to obtain mirror-like surface finish with no compromise on polishing rate.
Kona nano alumina water-based polishing slurry for Copper-Covered Ceramic Substrate provides a good surface finish with no compromise on polishing rate.

Alumina Polishing Slurry for Copper-Covered Ceramic Substrate Advantages


  1. Kona offers a range of polishing slurry for Ceramic & Copper-Covered Ceramic Substrates.

  1. Copper is a soft metal (Mohs hardness 3) , and it is a highly reactive metal and it oxidizes very easily. That increases the difficulty of polishing Copper-Covered Ceramic Substrate.

  1. Our Copper-Covered Ceramic Substrate Polishing Slurry designed for Copper-Covered Ceramic Substrate polishing process, it is a water-based nano alumina polishing slurry added a additive special for the characteristic of copper.

  1. Our Copper-Covered Ceramic Substrate Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate.


Gallery of Copper-Covered Ceramic Substrate Polishing Slurry

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE

ALUMINA POLISHING SLURRY FOR COPPER-COVERED CERAMIC SUBSTRATE

Long Slurry Life, Mirror Finish Surface

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+86-183 9090 8473

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inquiry@polishingslurry.com

undefinedAddress155 Suhong East Road, Suzhou Industrial Park, Jiangsu Province, China


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ALUMINUM NITRIDE CERAMIC LAPPING & POLISHING SLURRY

ALUMINA CERAMICS LAPPING & POLISHING SLURRY

CERAMIC LAPPING & POLISHING SLURRY