Redefining AI Power: The Pivotal Role of Indium Phosphide and Silicon Oxide in the Photon Era

Indium Phosphide: The Cornerstone of AI Computation in the Photon Era

As discussions around the explosive growth of artificial intelligence (AI) computational

power often center on the logical operation speed of GPUs or the bandwidth of HBM

memory, a silent revolution involving "light" is unfolding deep within data centers.

With the exponential increase in the parameters of large AI models, traditional copper interconnects are nearing their physical limits, making optical communication the only viable solution to break through computational bottlenecks. At the forefront of this transformation is indium phosphide (InP), heralded as the "golden material" in optoelectronics, while high-purity silicon oxide polishing liquids play a critical behind-the-scenes role in this journey towards high-performance optical modules.

The Highway of AI Computation

If GPUs are the brains of AI, then optical modules serve as the neural networks

connecting these brains. With 800G and even 1.6T optical modules becoming standard

in AI clusters, the significance of indium phosphide cannot be overstated.

Indium phosphide is a second-generation compound semiconductor material known for its high electron mobility and

exceptional optoelectronic properties. Unlike traditional silicon materials, indium

phosphide efficiently achieves electro-optical conversion. Within AI data centers, the massive exchange of data between

servers must be transmitted via optical signals, with indium phosphide serving as the

core substrate material for manufacturing high-speed laser and modulator chips.

As AI training demands low latency and high bandwidth continue to surge, optical modules are evolving towards higher integration and faster rates. The epitaxial layers grown on indium phosphide substrates directly determine the optical chip's light-emission efficiency, response speed, and signal integrity. It can be said that without high-quality indium phosphide, there would be no high-speed optical interconnect networks supporting large-scale cluster collaborations.

The Challenge of Achieving Ultimate Flatness

However, possessing a quality indium phosphide crystal is just the beginning.

Before it can be transformed into an optical chip, it must undergo a stringent

process—chemical mechanical polishing (CMP).

Indium phosphide materials are relatively brittle and extremely sensitive to surface defects. In optical chip manufacturing, even the slightest surface scratches, particle residues,

or nano-level unevenness can lead to lattice mismatches during epitaxial growth, resulting in dislocation defects. These defects can convert into noise during high-speed operation of the optical module, potentially causing device failures. Especially with the increasing popularity of silicon photonics technology, indium phosphide films must be heterogeneously integrated with silicon substrates, which requires atomic-level smoothness of the substrate surface.

Traditional polishing processes often struggle to balance "high removal rates" with "ultra-low damage layers." If the abrasives in the polishing liquid exhibit uneven hardness or poor dispersion, they can easily leave micro-cracks on the indium phosphide surface, diminishing chip yield and limiting the optical module's reliability during prolonged high-load operations. For data centers aiming to build a stable AI computational foundation,

such risks are fatal.

Silicon Oxide Abrasives: Precision Polishing with Soft Power

In contrast to harder abrasives like aluminum oxide or diamond, silica sol abrasives offer a "soft power" polishing solution for indium phosphide substrates, thanks to their unique spherical morphology and controllable particle size distribution.

Implementers of Atomic-Level Flattening

Silica sol particles exhibit extremely high monodispersity, meaning that during the

polishing process, each particle can uniformly participate in cutting,

avoiding deep scratches caused by particle agglomeration.

By precisely controlling the surface charge and pH of the silica sol,

the abrasive can form a uniform chemical reaction layer on the indium phosphide (InP)

surface, which is then gently removed through mechanical action.

This mechanism ensures that the surface roughness of the polished InP can be stably

controlled to below 0.2 nm, achieving a true mirror-like effect and laying a perfect

foundation for subsequent high-quality epitaxial growth.

Zero-Damage Surface Quality

The brittleness of indium phosphide requires that the polishing process be extremely

gentle. The moderate hardness of silica abrasives effectively removes the processed

damaged layer without introducing subsurface damage to the crystal surface.

This is crucial for enhancing the aging resistance of optical chips, directly extending

the lifespan of AI optical modules.

Customized Solutions

In response to the anisotropic characteristics of different crystal faces of indium

phosphide and the special needs of InP-based optical chips in hybrid bonding processes,

silica polishing slurry products is suitable for

fine polishing. Whether for large-diameter wafer polishing used in substrate

preparation or for thin-film flattening in silicon photonic integrated circuits, precise

removal rate selection ratios can be offered to ensure a wide and stable processing

window.

Empowering AI with Craftsmanship from the Microscopic World

As competition in AI computing power becomes increasingly intense, competition within

the industrial chain has descended to the level of basic materials. The performance

ceiling of optical modules depends not only on chip design but also on the quality of

substrate materials; and the quality of substrate materials ultimately hinges on the

precision of the polishing process.

When data travels at the speed of light within AI clusters, and trillion-parameter models

complete inferences in an instant, the brilliance of algorithms is complemented by

fine chemical enterprise meticulous work in the microscopic world. Countless nano-sized

silica particles have polished a smooth and unobstructed photonic channel for indium

phosphide.

We aspire to be the stepping stone of the photonic era, utilizing our exceptional abrasive
technology to support the construction of AI computing infrastructure.