EN
cn 
ja 
ko 
de 
es 
it 
vi 
th 
ms 
id 
Address:
155 Suhong East Road, Suzhou Industrial Park, Jiangsu Province, China 
WHAT ARE YOU LOOKING FOR?
In the wake of rapid advancements in electric vehicles, electric trains, and semiconductor technologies,
the electronics industry is facing unprecedented challenges in heat management.
High power, high frequency, and integration levels in electronic devices lead to significant heat generation,
which, if not dissipated effectively, can compromise chip efficiency and even result in semiconductor failure.
Research indicates that the effective lifespan of electronic devices can decrease by 30% to 50% for every 10°C increase in temperature.
Consequently, the demand for enhanced heat dissipation capabilities in circuit boards has surged, leaving traditional substrates and metal options inadequate for modern applications.
Amidst these challenges, ceramic substrates have emerged as a superior solution.
These specialized boards are created by bonding copper foil to ceramic materials such as alumina (Al2O3) or aluminum nitride (AlN) at high temperatures, resulting in ultra-thin composite substrates.
Characterized by excellent electrical insulation, high thermal conductivity, and robust solderability,
ceramic substrates can be etched into various patterns akin to traditional PCB boards while supporting large current loads.
Their impressive properties make them essential for the structural and interconnection technology of high-power electronic circuits.
The advantages of ceramic substrates extend beyond their thermal and electrical performance.
They boast high strength, minimal thermal expansion, exceptional chemical stability, and high thermal conductivity,
all of which align perfectly with the operational demands of high-power devices in the current marketplace.
However, creating these substrates presents its own set of challenges.
The manufacturing process involves critical steps such as mixing, shaping, grinding and polishing,
particularly when working with ultra-thin plates that can measure less than 1mm or even 0.3mm in thickness.
Ensuring precision during shaping and sintering is vital, and subsequent surface leveling, grinding, and polishing are required to achieve the desired quality.
As the electronics industry continues to evolve, manufacturers are increasingly tasked with meeting stringent requirements for surface roughness and flatness of ceramic substrates.
For instance, generally speaking, AlN ceramic substrates may need to be polished to achieve a surface roughness of Ra in the range of 3 to 5 nanometers.
To address these needs, ceramic substrate manufacturers are developing advanced polishing technologies tailored to enhance surface precision.
Given the diverse properties and structures of different ceramic materials, selecting the right polishing technology is crucial to meet the unique demands of each application.
The aluminum nitride and alumina ceramic substrate polishing slurry developed by our company is widely welcomed by our customers.
We are so glad to afford the sample of aluminum nitride and alumina ceramic polishing slurry for new customers to test. Look forward to a long time cooperation!
