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Address:
155 Suhong East Road, Suzhou Industrial Park, Jiangsu Province, China 
WHAT ARE YOU LOOKING FOR?
In recent years, the semiconductor industry has seen a significant shift towards the use of glass wafers, complementing the traditional silicon wafers that have long dominated the market. Silicon wafers, which are typically less than 1 millimeter thick and used to create various circuit components, have been the backbone of semiconductor manufacturing, giving rise to Silicon Valley's name. However, glass wafers, made from glass material, are emerging as a crucial alternative, particularly in advanced packaging technologies and optical applications.
Unlike silicon, which is a semiconductor, glass is an insulator, meaning that glass wafers do not function as electrical circuits themselves. Instead, they serve primarily as carriers for silicon wafers, providing unique advantages, such as transparency, which allows for easier detection of defects during the manufacturing process.
As integrated circuit (IC) packaging evolves from 2D to 3D structures, glass wafers are playing an increasingly vital role. Particularly noteworthy is the development of Through Glass Via (TGV) technology, which offers a more cost-effective and lower-loss alternative to the expensive silicon Through Silicon Via (TSV) technology.
In traditional optics, glass wafers excel as optical components, especially in infrared applications. They are also finding applications in augmented reality (AR) and mixed reality (MR) devices, where high-refractive-index glass wafers are used in waveguide solutions. Additionally, in LED manufacturing, glass wafers are commonly employed as substrate materials, enhancing both the light-emitting efficiency and stability of LEDs.
To meet the growing demand for high-quality glass wafers in downstream semiconductor, 3C, optical, medical, and biotechnology industries, manufacturers are adapting silicon wafer processing techniques while leveraging their own experience with glass substrates. This includes research and experimental development in areas such as material production, raw material preparation, precision annealing, multi-blade cutting, forming processes, precision grinding and polishing, as well as final inspection and packaging.
A critical aspect of glass wafer production is the grinding process, which involves multiple stages to reduce roughness and eliminate surface defects caused by manufacturing processes. The responsibility of engineers involved in the polishing process is paramount, as their work directly affects the quality of the final product.
After extensive experimentation, it has been determined that Chemical Mechanical Polishing (CMP) is currently the only commercial technology capable of achieving both local and global planarization of semiconductor wafer surfaces. This technique is essential in integrated circuit manufacturing, and glass wafers are increasingly utilizing CMP for their polishing processes.
Our company is proud to collaborate with clients in refining polishing solutions for glass wafers. Through cooperative testing, we have discovered that acidic polishing solutions provide an optimal balance between surface quality and efficiency for glass wafer polishing. We invite customers in need of glass wafer polishing solutions to contact us, and we look forward to the opportunity to work together!
