Address:
155 Suhong East Road, Suzhou Industrial Park, Jiangsu Province, China
As integrated circuit technology advances, the demand for flatness between material layers in semiconductor manufacturing becomes increasingly crucial, driven by smaller feature sizes and the realization of high-density devices. Chemical Mechanical Polishing (CMP) has emerged as the key technology for achieving global planarization, addressing the heightened requirements for surface quality and processing efficiency in semiconductor fabrication and optical material production.