Copper-Covered Ceramic Substrate Polishing Slurry is developed for Copper-Covered Ceramic Substrate such as Copper-Clad ceramic substrate and Copper-Coated ceramic substrate.
According to the characteristics of copper material and high requirements of the PCB fabricate, it is a challenge to obtain mirror-like surface finish with no compromise on polishing rate.
Kona nano alumina water-based polishing slurry for Copper-Covered Ceramic Substrate provides a good surface finish with no compromise on polishing rate.
Kona offers a range of polishing slurry for Ceramic & Copper-Covered Ceramic Substrates.
Copper is a soft metal (Mohs hardness 3) , and it is a highly reactive metal and it oxidizes very easily. That increases the difficulty of polishing Copper-Covered Ceramic Substrate.
Our Copper-Covered Ceramic Substrate Polishing Slurry designed for Copper-Covered Ceramic Substrate polishing process, it is a water-based nano alumina polishing slurry added a additive special for the characteristic of copper.
Our Copper-Covered Ceramic Substrate Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate.